High density acoustic composite wall boards
HiDECK Overlay 18 is ideal for flooring applications incorporating an underflooring heating system due to its high thermal conductivity which provides rapid reaction times, saving on running costs. In addition, its high density makes it perfect for a variety of acoustic applications.
Related products
YELOfon ES5
Cellecta PRO Adhesive
XFLO FF 250
ULTRAplate 1i
Architect and specifier resources
Third Party Accreditation and Approvals
Specifications
Brand name
HiDECK Overlay 18
Product description
Tongue & groove, low thermal resistance overlay floorboard
Thickness
18mm
Composition
High density gypsum
Thermal resistance (m²/KW)
0.045
Board dimensions
600mm x 1200mm
Weight
21.60kg/m² - 15.55kg/board
Flanking/edge strips
YELOfon FS50, ES5/100
Excellent airborne sound absorption
Thin treatment, only 18 mm thick
Impact resistant, high density gypsum facing
Robust Detail and Proprietary applications
Handling and Storage
Store inside
This product should be stored inside on a pallet in water-tight conditions on a dry, flat and level base.
It can only be stored in a single lift, do not double stack.
If you are required to re-stack the product, we advise that the boards are stored on a pallet or are fully supported from the underside.
Care should be taken not to damage the edges of the board whilst re-stacking. The stacking of the product on it's edges should be avoided, as this can lead to damage.
Product protection
This product is supplied on pallets, wrapped in temporary protection. This covering is to offer dust protection and is a temporary measure to protect the boards from the weather during the loading/unloading process, it is not a waterproof cover and should be stored inside.
Adhesives and primers need to be protected from frost damage. They should be stored & used at temperatures between 5°C and 35°C and kept out of direct sunlight.