Chipboard/extruded polystyrene thermal laminate
XCHiP combines the benefits of HEXATHERM high-performance thermal insulation with P5 moisture-resistant, tongue and groove chipboard to produce a high compressive strength, interlocking floorboard.
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Architect and specifier resources
Third Party Accreditation and Approvals
Specifications
Brand name
HEXATHERM XCHIP
Product description
Chipboard/extruded polystyrene thermal laminate
Thermal conductivity
0.033W/mK < 80mm, 0.034W/mK > 81mm
Long term water absorption by immersion
<0.7%
Chipboard grade
P5
Edge profile
Tongue & groove
Board size (mm)
600 x 2400
Thickness (mm)
48, 58, 68, 78, 98, 118, 138, 158, 178
P5 Chipboard facing with tongue & groove interlocking edge profile
High compressive strength insulation
Excellent life-long thermal performance
Robust Detail and Proprietary applications
Handling and Storage
Store inside
This product should be stored inside on a pallet in water-tight conditions on a dry, flat and level base.
It can only be stored in a single lift, do not double stack.
If you are required to re-stack the product, we advise that the boards are stored on a pallet or are fully supported from the underside.
Care should be taken not to damage the edges of the board whilst re-stacking. The stacking of the product on it's edges should be avoided, as this can lead to damage.
Product protection
This product is supplied on pallets, wrapped in temporary protection. This covering is to offer dust protection and is a temporary measure to protect the boards from the weather during the loading/unloading process, it is not a waterproof cover and should be stored inside.
Adhesives and primers need to be protected from frost damage. They should be stored & used at temperatures between 5°C and 35°C and kept out of direct sunlight.