
Low Profile, High Compressive Strength Underfloor Heating Floorboard

Sample request
Product Information
Cellecta’s XFLO Micro low profile underfloor heating insulation boards have an ultra high compressive strength ideal for domestic and commercial flooring applications. Once covered with ScreedBoard or a floor decking, they provide an effective solution to limited height underfloor heating projects.
Product Benefits
Low profile, as thin as 15mm
Ultra high compressive strength – 500kPa
Manufactured to suit pipe and centres required
Easy to cut to size and install
Works in conjunction with acoustic treatments
Technical Information
Brand name | XFLO Micro |
Product description | Low profile, ultra high compressive strength, underfloor heating board |
Strength at 10% compression | 500kPa |
Thermal conductivity | 0.035W/mK |
Temperature range | -50°C/+75°C |
Route sizes available (to suit pipe diameter) | 10mm, 12mm, 15mm, 16mm |
Pipe centres | 150mm |
Board dimensions | 600mm x 1200mm |
Thickness’ | 15mm, 18mm, 20mm, 25mm |
Third Party Accreditation and Approvals


Environmental Credentials & Fire Class


