XFLO Micro

Description

Low Profile, High Compressive Strength Underfloor Heating Floorboard

Product Information

Cellecta’s XFLO Micro low profile underfloor heating insulation boards have an ultra high compressive strength ideal for domestic and commercial flooring applications. Once covered with ScreedBoard or a floor decking, they provide an effective solution to limited height underfloor heating projects.

Product Benefits

Low profile, as thin as 15mm

Ultra high compressive strength – 500kPa

Manufactured to suit pipe and centres required

Easy to cut to size and install

Works in conjunction with acoustic treatments

Technical Information

Brand name	XFLO Micro
Product description	Low profile, ultra high compressive strength, underfloor heating board
Strength at 10% compression	500kPa
Thermal conductivity	0.035W/mK
Temperature range	-50°C/+75°C
Route sizes available (to suit pipe diameter)	10mm, 12mm, 15mm, 16mm
Pipe centres	150mm
Board dimensions	600mm x 1200mm
Thickness’	15mm, 18mm, 20mm, 25mm