XFLO Micro FF

Description

Low Profile, High Compressive Strength Underfloor Heating Floorboards with Conductive Facing

Product Information

Cellecta’s XFLO Micro FF low profile routed under floor heating insulation boards have an ultra high compressive strength and aluminium foil facing for added thermal diffusion. Once covered with ScreedBoard or a floor decking, they provide an effective solution to limited height underfloor heating application.

Product Benefits

Low profile, as thin as 15mm

Aluminum foil facing for improved heat

diffusion

Ultra-high compressive strength – 500kPa

Manufactured to suit pipe and centres required

Easy to cut to size and install

Technical Information

Brand name	XFLO Micro FF
Product description	Aluminium ow profile, ultra high compressive strength, underfloor heating board
Strength at 10% compression	500kPa
Thermal conductivity	0.035W/mK
Temperature range	-50°C/+75°C
Route sizes available (to suit pipe diameter)	10mm, 12mm, 15mm, 16mm
Pipe centres	150mm
Board dimensions	600mm x 1200mm
Thickness’	15mm, 18mm, 20mm, 25mm