HEXATHERM XFLO 500

High Compressive Strength Underfloor Heating Floorboard

Product Information

Cellecta’s XFLO 500 boards are made from high compressive strength extruded polystyrene able to withstand the rigours of the installation process as well as the long term loads imposed in residential and commercial applications. The boards are manufactured to suit the pipe diameter and spacing required to achieve the desired thermal output.

Product Benefits

High resistance to compression – 250, 300 & 500kPa

Manufactured to suit pipe and output requirements

Works in conjunction with acoustic treatments

Technical Information

Brand name	XFLO 250	XFLO 300	XFLO 500
Product description	High compressive strength underfloor heating board	High compressive strength underfloor heating board	Ultra strength UFH board
Strength at 10% compression	250kPa	300kPa	500kPa
Thermal conductivity	0.033W/mK	0.033W/mK	0.035W/mK
Temperature range	-50°C/+75°C	-50°C/+75°C	-50°C/+75°C
Route sizes available (to suit pipe diameter)	10mm, 12mm, 14mm, 15mm, 16mm, 18mm, 20mm	10mm, 12mm, 14mm, 15mm, 16mm, 18mm, 20mm	10mm, 12mm, 14mm, 15mm, 16mm, 18mm, 20mm
Pipe centres	150mm, 200mm, 300mm	150mm, 200mm, 300mm	150mm, 200mm, 300mm
Board dimensions	600mm x 2500mm	600mm x 2500mm	600mm x 1250mm
Thickness’ (other sizes manufactured to order)	20mm, 25mm, 30mm, 35mm	40mm, 50mm, 60mm, 75mm	50mm, 60mm, 75mm